VB200 is a thermal interface material (TIM) developed using a special elastomer designed to address thermal management issues associated with the recently miniaturized and high integration of electronic devices. With an excellent thermal conductivity of 38W/m K in the thickness direction (Z axis), VB200 efficiently transfers heat when applied to electronic components.
Thin sheets as thin as 100 μm are available using special processing technology.
Long Term Durability (High Heat Resistance, High Durability)
Maintains excellent thermal performance even after long-term storage at high temperatures and after heat cycling.
Wide-Ranging Applications
VB200 takes advantage of its high thermal conductivity to efficiently transfer heat by filling gaps in heat-generating components such as IC chips and ECU, as well as heat sinks.
Typical Applications
CPU/GPU Packages
ECU (Electronic Control Unit)
Inverter (Power Control Unit)
Details
High thermal conductivity / Wide-ranging applications
Zeon’s TIM can be applied to both TIM 1 and 2 applications.
Quality Test
Basic Physical Properties (VB200)
For thicknesses outside this range , please contact us.
This value is measured by Zeon based on ASTM D5470 and is not guaranteed.
Measured under the following conditions: Thickness 100µm,Temperature 50℃,Plessure 0.3MPa. Those above data are measured values and not guaranteed values.
Thermal Resistance Comparison
The data above is the actual measurement data at Zeon based ASTM D5470.
Durability Testing (High-Temperature, Long-Term Storage and Heat Cycling)
Testing method
From the structure above (Copper plate + TIM + aluminum plate) and conduct heat resistance and durability testing.
Evaluate the thermal resistance of the structure.
High-Temperature, Long-Term Storage
Maintained thermal resistance equivalent to initial values, even after long-term high-temperature storage at 150°C for 1,000 hours.
Heat Cycling
Maintained excellent thermal performance, even after heat cycles at temperatures alternating between −55°C and 100°C.
Durability Testing (Reflow Testing)
VB200’s thermal diffusivity performance remained almost unchanged from initial values after 10 reflow cycles.
Test condition
Feed the VB200 into the reflow oven at a transfer speed of 0.3m/min.
During reflow, temperatures were held above 200℃ for 1 minute with a maximum temperature of 260℃.
Repeat the reflow up to 10 times on the same sample.
Thermal diffusivity is measured after each reflow.
Product Information
Regular Sheet Size
150mm x 150mm
Thickness
100~260μm
Please contact us about specific size and thickness requirements.
