Multi-Material Adhesive (Development Products LS)
Proposing Solutions for Next-Generation Mobility
We offer a new transparent adhesive film (Development product "LS") as a solution for addressing the needs and challenges for the mobility industry, which is now undergoing a revolutional transformation. ZEON will be playing our part to realize a new mobility society by introducing an entirely new transparent adhesive film.

Realizing Highly Rigidity and Lightweight Structures

Efforts to bring about a new mobility society are driving a growing need for bonding all sorts of materials. The LS series bonds strongly without surface treatment to inorganic and organic materials, including polypropylene and polycarbonates. Our LS series enables adhesion between dissimilar materials used in mobility vehicles and helps reduce weight. Moreover, the thermoplasticity of our material enables disassembly and facilitation of recycling substrates.
Cost reduction by Eliminating the Need for Mechanical Fastening

The LS series film is a new material with the potential of overturning conventional wisdom on adhesives. The strong adhesion and stability is realized by the chemical bonding structure and low water absorption properties, which distinguishes it's perfomances from conventional adhesives. This film is also characterized by an excellent long-term reliability that other adhesives cannot match, making it a strong contender for reducing mechanical fastening, which until now has been difficult to realize.
Protection of Flexible Optical Devices

The LS series film offers outstanding optical properties and low water absorbency which can be applied to sealing embedded devices in glasses. The film type material will address the challenges that must be overcomed in order to produce electronic devices capable of supporting new technologies such as Autonomous-Driving. In addition to its optical properties and low water absorbency, the film’s low outgassing and high electrical properties also prevent device corrosion, supporting the production of high-quality devices.
Reduced Transmission Losses realized by Low Dielectric Properties

Technological innovation in substrate materials continues to advance to meet the growing need for new-generation mobile communication systems with higher speeds and greater capacity. The LS series will contribute by reducing the transmission losses of substrates due to its excellent electrical properties and strong adhesion to copper.
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